Polishing of Si Single Crystals with an Elastic Wheel

Abstract

This paper deals with the polishing operation of Si single crystal wafers. Scratches made on Si wafers were microscopically observed and then the fundamental polishing mechanisms were discussed. From the results of polishing experiments by using various polishers, characteristics are investigated and a new polishing wheel was developed. It was shown that the wheel was available to make the fine surfaces of Si wafers.