Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath IV. Acceleration Mechanism in the Presence of Cl- Ions

Denki Kagaku oyobi Kogyo Butsuri Kagaku

Online ISSN : 2434-2556
Print ISSN : 0366-9297

Technical Papers

Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath IV. Acceleration Mechanism in the Presence of Cl^- Ions

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1983 Volume 51 Issue 6 Pages 460-464

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