Kobunshi Kagaku
Online ISSN : 1884-8079
Print ISSN : 0023-2556
ISSN-L : 0023-2556
Curing Mechanism of the Epoxide Resins
Masaki ShimboMitsukazu Ochi
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1971 Volume 28 Issue 320 Pages 982-986,1014

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Abstract
Mechanism of the curing reaction for bisphenol-type epoxide resin and its derivatives having methyl side group in the main chain in the presence of various harciners, such as aliphatic and aromatic amines, polyamide, and acid anhydride has been studied by the measurements of dynamic mechanical properties of the cured resin.
Tensile shear strength of cured epoxide resin in cohesive fracture region is a function of Me. or modulus. Inthe case of a peeling test, the mechanism of fracture changes from cohesive to contact fracture according to theircrosslinking density, and the maximum value of peel strength is observed at the transition point. Glass transitiontemperature of the system coincide with the test temperature at this point.
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© The Society of Polymer Science, Japan
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