Excimer-Laser-Based, Thin Beam Directional 'Xtallization (TDX) and Thin Beam Based LTPS Technology for Processing Large Area Poly-Silicon

M.Shane BOWEN; David S. KNOWLES

doi:10.2184/lsj.34.689

The Review of Laser Engineering

Online ISSN : 1349-6603
Print ISSN : 0387-0200
ISSN-L : 0387-0200

Excimer-Laser-Based, Thin Beam Directional 'Xtallization (TDX) and Thin Beam Based LTPS Technology for Processing Large Area Poly-Silicon

M.Shane BOWEN, David S. KNOWLES

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Keywords: Low-Temperature Poly-Silicon (LTPS), Thin Beam Directional Xtallization (TDX), Sequential lateral solidification (SLS), Excimer laser Annealing (ELA), Flat panel display, electronic materials

JOURNAL FREE ACCESS

2006 Volume 34 Issue 10 Pages 689-692

DOI https://doi.org/10.2184/lsj.34.689

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Abstract

This paper provides a review of Thin Beam Directional 'Xtallization (TDX) technology and presents the most recent experimental results illustrating the versatility of thin beam based LTPS processes. As the TDX process moves toward full production, these results confirm the viability of using a thin beam for SLS and for micro-ELA processing as alternative, and complementary, operational modes of the TCZ-900X laser annealing tool.

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