22） M. Fujita, H. Ohkawa, M. Otsuka, T. Somekawa, Y. Maeda, Y. Orii, K. Inaba, G. Okada, and N. Miyanaga: Proceedings of the 1st Smart Laser Processing Conference (SLPC), Yokohama, Japan (2014) SLPC9-3.

Abstract

In this paper, we report a laser cutting process in glass using a pulse CO2 laser. We achieved drilling micro-through-holes in glass using a transverse-flow pulse CO2 laser with short pulses and verified a drilling speed of 800 holes per second with a 40-μm diameter. The smallest through-hole drilled in the glass substrate was a diameter of 25 μm. By continuously connecting the drilled holes, the glass substrates can be cut into arbitrary forms. We believe that cutting glass with a pulsed CO2 Laser is an effective processing method.