Thermally Activated Process during Dislocation Motion in Ultrafine-Grained Copper

Materia Japan

Online ISSN : 1884-5843
Print ISSN : 1340-2625
ISSN-L : 1340-2625

Thermally Activated Process during Dislocation Motion in Ultrafine-Grained Copper

Takahiro Kunimine

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Keywords: thermally activated dislocation motion, activation volume, deformation mechanism, face-centered cubic (fcc) metals, copper, severe plastic deformation (SPD), accumulative roll-bonding (ARB), ultrafine-grained (UFG) metals, dislocation bow-out model

JOURNAL FREE ACCESS

2012 Volume 51 Issue 3 Pages 102-107

DOI https://doi.org/10.2320/materia.51.102

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© 2012 The Japan Institute of Metals and Materials

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