Materia Japan
Online ISSN : 1884-5843
Print ISSN : 1340-2625
ISSN-L : 1340-2625
Development of Cr-Cu Composites for Heat-sink of Semiconductor Devices
Hoshiaki Terao, Hiroshi Wada, Hideaki Kobiki, Hiroki Ota, Yukihiro Matsubara
Author information
JOURNAL FREE ACCESS

2014 Volume 53 Issue 2 Pages 66-68

Details
Download PDF (1948K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2014 The Japan Institute of Metals and Materials
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

Bulletin of the Japan Institute of Metals

Share this page
feedback
 Top