Bulletin of the Japan Institute of Metals
Online ISSN : 1884-5835
Print ISSN : 0021-4426
ISSN-L : 0021-4426
Micro-solder Bonding Technology for IC-LSI
Ryohei Satoh, Muneo Ohshima, Kazuo Hirota, Ichiroh Ishi
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Keywords: micro-solder bonding, integrated circuit, large scale integrated circuit, flit chip bonding, mechanical properties, bonding reliability, finite element method, fatigue, strain range, equivalent strain
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1984 Volume 23 Issue 12 Pages 1004-1013

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