Materia Japan
Online ISSN : 1884-5843
Print ISSN : 1340-2625
ISSN-L : 1340-2625
Present Status and Future Technology of Aluminum Conductor Materials for Semiconductor Devices
Takashi Onishi
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Keywords: aluminum conductor, metallization technology, semiconductor, large scale integration, liquid crystal display, electromigration, stress migration, hillock, void, reliability
JOURNAL FREE ACCESS

1994 Volume 33 Issue 6 Pages 755-759

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