Materia Japan
Online ISSN : 1884-5843
Print ISSN : 1340-2625
ISSN-L : 1340-2625
New Material for Multilevel Metallization in Sub-micron LSIs
Nobuo Owada
Author information
Keywords: large scale integrated circuit, metallization, copper, low dielectric constant insulator, electroplating, chemical mechanical polishing
JOURNAL FREE ACCESS

2004 Volume 43 Issue 1 Pages 7-11

Details
Download PDF (4382K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© The Japan Institute of Metals
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

Bulletin of the Japan Institute of Metals

Share this page
feedback
 Top