Materia Japan
Online ISSN : 1884-5843
Print ISSN : 1340-2625
ISSN-L : 1340-2625
Atomic and Electronic Structure of Wide Gap Semiconductor Grain Boundaries
Hideki Ichinose, Eriko Takuma, Hidetaka Sawada
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Keywords: dangling bond, SiC, diamond, grain boundary atomic structure
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2004 Volume 43 Issue 12 Pages 984

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