Abstract
The cause of deterioration in PCB (printed circuit board) is due to the migration of copper ion. We carried out bias test under high temperature and high humidity, and discussed the deterioration of PCB due to ionic migration. Some compounds were added in adhesive as impurity and the two adhesives having different glass transition temperature were used to adhere copper with polyimide film. The development of the ionic migration resulted in the decrease of deterioration time. The deterioration time became short with the increase of impurity content and with the decrease of glass transition temperature.
