2023 Volume 11 Issue 4 Pages 158-163
A proximity capacitance image sensor and measurement system for high-sensitivity and high-resolution display inspection adopted a new step-type bonding pad structure with the thin protective film on the pixels have been developed. This sensor and system have good detectability of line and point defects in the active area on a 264 ppi thin film transistor substrate and defects of fine pitch wires in peripheral fan-out areas and complex gate driver on array areas. This technology enabled the contactless detection of fine defects in pixel and peripheral areas on display substrate, and thus, further quality and yield improvement of flat panel displays are expected.