Abstract
The minimum size of devices integrated in LSI (Large Scale Integrated Circuit) is reduced every year. It will be as small as 0.1μm in the near future. In the course of developing such small devices, physical limitations or quantum effects are predicted to play an important role. The purpose of this article is to stress the importance of fluid mechanics for future LSI processing. It will be accomplished through the explanation of some topics in semiconductor processing, waiting for analyses based on fluid mechanics. These topics cover cleaning, oxidation, chemical vapor phase deposition, reflow of thin films, uniformity of coated films, and air flow in the clean room.
