Application to the Electronic Devices of Cyanate Ester Resin

Abstract

Cyanate ester polymer has been put to practical use as heat-set resin in some fields. Especially BT resin, blend of cyanate ester resin and bismaleimide, bearing improved moisture absorption has a superior characteristic for a high frequency use. The homopolymer of the cyanate ester has high T_g about 300℃, but high cure temperature, high heat of polymerization and brittleness are unsolved problems. However, the fault is made up by modification with other monomers and the filler addition. Improvement of the operating temperature of the power electronics inverter devices gives new development target of the encapsulate and thermally-conductive seat. In addition to epoxy, benzoxazine, maleimide and cyanate ester are expected in the range of T_g ≥ 200℃. An application of cyanate ester toward the next generation is expected because of high T_g at low cure temperature.