Creation of Novel Thermosetting Matrix Resin for Carbon Fiber Reinforced Composite Material and its Molecular Design

Abstract

Curing behavior of the bisphenol A type epoxy resin and properties of the cured product were investigated using an acid anhydride having phenylethynyl carbonyl group as a curing agent. As a result, it was found that the reaction of the acid anhydride group and the epoxy group proceeded first at around 100 to 120 ℃, and then was follwed by the reaction of the phenylethynyl carbonyl groups at around 250－300 ℃. As a result of examining the properties of the cured product, it was found that the epoxy resin cured with an acid anhydride having phenylethynyl carbonyl group showed extremely excellent heat resistance and thermal decomposition resistance. These excellent thermal properties are attributable to strong intermolecular interaction (molecular packing) and suppression of movement of molecular chains by alkenes and polycyclic aromatic structures formed by polymerization of phenylethynylcarbonyl groups.