2020 Volume 41 Issue 5 Pages 201-206
There is an epoxy resin having an ether ether ketone (EEK) structure as one measure for improving the heat resistance of the epoxy resin. A bisphenol compound having an EEK unit was obtained by the reaction of hydroquinone and 4,4'-difluorobenzophenone, and then an epoxidation reaction was performed to synthesize an epoxy resin having an EEK unit (DGEEK). As a result of evaluating the physical properties of the cured product obtained from DGEEK and phenol novolac, the glass transition temperature (Tg) was 149℃, which was 22℃ higher than that of bisphenol A type epoxy resin (DGBPA). Further, the 10wt% weight loss temperature (Td10) was 406℃, confirming high thermal stability. Furthermore, the char yield at 700℃ was 35.0wt%, which was more than double the value of the cured product from DGBPA.
