2020 Volume 41 Issue 6 Pages 252-259
An epoxy resin having a biphenylene ether structure (BGPB) was synthesized, and the physical properties of the cured products obtained by curing with phenolic curing agents were investigated. When phenol novolac was used as the curing agent, the glass transition temperature of the BGPB cured product was 159℃, which was 32℃ higher than that of bisphenol A type epoxy resin (DGBPA) and 7℃ higher than that of biphenylaralkyl type epoxy resin (GBPAR). The char yield at 700℃ was 37.8 wt%, which was significantly higher than 28.0 wt% of GBPAR, and the 10% weight loss temperature was 408℃. These results indicate high thermal decomposition stability of the BGPB cured product. In addition, the cured product with 4,4'-oxybisphenol (OBP) gave a crystalline polymer having a melting point at 257.4℃. The thermal conductivity was 0.32 W/m・K, which was about 1.5 times that of the DGBPA polymer.
