2021 Volume 42 Issue 4 Pages 158-164
There is an epoxy resin having an ether ether ketone (EEK) structure as one measure for improving the heat resistance of epoxy resin. After obtaining a phenolic oligomer (HREEK) by the reaction of resorcinol and 4,4'-difluorobenzophenone, an epoxidation reaction was performed to synthesize an epoxy resin (GREEK) having a softening point of 62－94℃. As a result of evaluating the physical properties of the cured product using phenol novolac as a curing agent, the glass transition temperature was 146℃, which was 19℃ higher than that of the bisphenol A type epoxy resin (DGBPA). In addition, low thermal expansion and high thermal decomposition stability were confirmed due to the EEK structure. Furthermore, when HREEK was used as a curing agent, the 10 wt% weight loss temperature was 421℃ and the residual carbon rate was 53.7wt%, which were extremely high values as a cured epoxy resin product
