Development of Photo-Melt Resin

Abstract

Recently, many materials liquefied by exposure to light have been reported as a photo-melt resin. However, previously reported photo-melt materials tend to have complicated resin design, mechanism and synthetic pathway. In this report, the photo-melt resin was obtained from the mixture of commercially available materials, and it was assumed that the covalent bond in the polymer was cleaved by the reaction between the photo-induced radical and the disulfide bond. The photo-melt resin shows rubber elasticity and liquefied by exposure to light. When the resin was applied to the adhesive, a significant decrease in adhesiveness due to exposure was observed. This technology is expected to be applied to an easy-torelease adhesive, temporary adhesive, photo-softening pressure sensitive adhesive, coating resin and novel photolithography materials.