Functional Thermoset Materials Applied to CCL (Copper Clad Laminate) Resins Composed by 1, 2-Vinyl Cross-linking

Abstract

Electronic applications generally require products with low polarity and good dielectric properties. Materials that exhibit active crosslinking sites with the ability to form double bonds are chosen frequently for superior performance. In particular, materials thermally cured that form cross-linked vinyl units are most advantageous for dielectric properties.Products such as copper clad laminates (CCL) are actively being studied to better suit 5G and future 6G technology.Communication devices, such as cell towers, require CCL with high performance, usually selecting compounds that can ensure high crosslinking density. Polybutadiene with a high level of 1, 2-vinyl units in the molecular chain are commonly used in these applications. This high-vinyl technology can also be applied to Styrene－Butadiene－Styrene, or, 1,2-SBS.Additional studies are underway for most effective heat curing methods and additives to complete these functions. In this paper, we analyze CCL raw materials and explain these effects through actual examples of these materials.