2022 Volume 43 Issue 3 Pages 100-104
An epoxy resin having a m-terphenyl structure (DGMTP) was synthesized and the physical properties of a cured polymer obtained by curing with 4,4'-dihydroxydiphenyl ether were evaluated. DGMTP gave a crystalline cured polymer with a melting point of 202.2℃, which was 14.8℃ higher than that of epoxy resin having a diphenylene ether structure. The thermal conductivity of crystalline DGMTP cured polymer was 0.31 W/m·K, which is about 1.5 times that of the amorphous cured polymer from bisphenol A type epoxy resin. In addition, the moisture absorption was reduced by about 50%.
