Application for High Thermal Conductive Sheet using Specially Shaped Polyhedral Alumina Filler

Abstract

Synopsis

Recently, the miniaturization, high integration, and high performance of module products have been remarkably advanced on various electronic devices. The amount of heat generated inside is steadily increasing. Therefore, the materials used for them are required to have high heat dissipation. In this paper, we report on the development of specially shaped polyhedral alumina and the study of its application to high heat conductive sheets. AlN and BN are being actively studied as high thermal conductivity fillers, but there are problems with chemical stability and high filling properties. In addition, its use on 10W/mk sheet, where the market is expanding, is also a high cost issue. We investigated the improvement of the performance of alumina and developed a specially shaped polyhedral alumina. We examined the application to the sheet using the developed polyhedral alumina, and achieved the general property required for the heat dissipation sheet.