2023 Volume 44 Issue 1 Pages 27-34
In 5G and advanced driver-assistance systems, transmission loss imposes a challenge for their use in high-frequency regions. The insulating materials in semiconductor packages for high-frequency applications thus require low dielectric properties. We report the technological trends in low dielectric resin, low-loss molded underfill (MUF) and low-loss copper clad laminate (CCL) in high-frequency semiconductor packages.For the next generation low dielectric resin, the target dissipation factor (Df) would be ≦ less than 0.001. A simulation on the transmission loss of MUF assuming an antenna in package (AiP) showed that the reduction of Df has a significant influence on the transmission loss. Furthermore, we developed CCL that satisfy both low coefficient of thermal expansion (CTE) and low dielectric properties by improving the compatibility of low CTE and low polarity resins. Low-loss MUF and low-loss CCL are expected as semiconductor packaging materials for millimeter-wave-compatible AiP and RF front-end (RFFE) modules.
