Development of highly thermal conductive polymer composite where the thermal contact resistance of fillers is greatly reduced by having dual phases structures and that similar one

Abstract

We have studied thermal conductivity of polymer composite in focusing on the influence factor of thermal contact resistance between fillers, which didn't attract much attention. At first, thermal conductivity of the composite in a dual phase structure was estimated by a finite element method, then it was predicted that the thermal conductivity increased exponentially in the range of phase inversion.Further, we prepared the composite by the SPS molding method in order to form a dual phase structure, and succeeded in creating a percolation phenomenon in the thermal conductivity of polymer composite. We also discovered the method to obtain polymer composite with electrically conductive or insulating fillers, where the thermal contact resistance between fillers was greatly reduced, by using conventional polymer processing (injection and compression molding etc.).