Low dielectric material with heat resistance

Abstract

The CCL (copper clad laminate) used in 5G communication millimeter-wave requires both low dielectricity(D_f , D_k) and high Tg (heat resistance). There is a trade-off relationship between low dielectric and heat resistance, however there no materials available that simultaneously satisfy both of these properties. Therefore, before the curing, multiple monomers and inorganic fillers are blended in the varnish solution. Be that as it may, the mixture of a plurality materials does not satisfy the compatibilities well, it is not an effective method. For this compatibilities issue, block type polymer linking with some functional units by chemical bond has been proposed. In this paper, we first analyzed the polymer units that have played significant role diverse properties in the CCL fields. Based on this analysis, the next step was to design a block type polymer in which Isobornyl methacrylate and 1,2-polybutadiene units are chemically bonded to contribute low dielectricity and heat resistance. We confirmed and explained these effects and discussed the excellent materials for CCL.