Development of Phosphonate Polybutadiene based on Flame Retardant Analysis

Abstract

Research and development is currently underway to develop copper-clad laminates (CCL) that are suitable for the next era of ICT technology. This advancement is driven by the need for enhanced capacity and speed, essential for 5G and 5G millimeter wave communications.These cutting-edge communications rely on high-frequency bands, which increase electrical losses and generate heat then contained within CCL boards during processing. Consequently, there’s a risk of flexing or bending in the CCL,potentially leading to short circuits and fires. Thus, ensuring a high glass transition point (Tg) and incorporating flame retardant properties are imperative for CCL materials utilized in high-frequency communications. However, pursuing advanced CCL materials has been hindered by the trade-offs between achieving flame retardancy, maintaining low dielectricity, ensuring high Tg (heat resistance), and ensuring compatibility with flame retardant components.This paper aims to elucidate the mechanism behind flame retardancy and offer examples of flame-retardant lowdielectric compounds characterized by both low dielectricity and high Tg.