Abstract
Low-modulus die-bonding films (reaction-induced polymer alloy films) are useful for stacked multi-chip packages which are suitable for compact electronic devices. Properties of the films are widely changed by the ratio of epoxy resin and acrylic polymer contents. To optimize the properties of the die-bonding films for thin wafer application, the influence of various parameters on material properties was examined by using the linear programming method for materials design. The film designed by the programming showed excellent adhesion strength and shelf life.
