Abstract
Low-modulus die-bonding films made of reaction-induced polymer alloy are useful for stacked multi-chip packages, which are suitable for compact electronic devices. Properties of the films are widely varied by the ratio of epoxy resin and acrylic polymer contents. To optimize the properties of the die-bonding films for thin wafer application, the influence of various parameters on material properties was examined by using the weak conditioned combinatorial linear programming method and nonlinear estimation. By defining solution area as a function of combination index, optimum filler size is acquired.
