Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Original
Study on Lignophenol-Cured Epoxy Resins.
Shohei TsudaKaori NakagawaToshiyuki OyamaAkio TakahashiYoshiaki OkabeHiroyuki KagawaShinji YamadaYoji Okabe
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JOURNAL OPEN ACCESS

2010 Volume 31 Issue 2 Pages 75-83

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Abstract
SynopsisPreparation of lignophenol (LP)-cured epoxy resin (LER) and evaluation of properties of the obtained resin were studied as a part of effective use of biomass materials. Curing reaction between LP and bisphenol A diglycidyl ether (DGEBA) was carried out by heating up to 180 °C in the presence of imidazole derivative (2E4MZ-CN) to afford LERs as novel thermosetting resins (LERs). LERs had well-balanced thermal and mechanical properties. Especially, LER2 (epoxy group : phenol group = 1 : 0.9 ) showed the superior properties, that is, glass transition temperature (Tg) of 198 °C and 5% weight loss temperature (Td5) of at 373 °C. The Tg was more than 60 °C higher than that of the conventional phenol novolac-cured DGEBA. However, the flexural strength of LER2 was 134 MPa, which was a little lower than that of the phenol novolaccured DGEBA. From these results, it was demonstrated that LP was a promising curing agent for epoxy resins.
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© 2010 Japan Thermosetting Plastics Industry Association
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