Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Review
Design Technologies of High Performance Epoxy Resins
Ichiro Ogura
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JOURNAL OPEN ACCESS

2010 Volume 31 Issue 3 Pages 113-124

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Abstract

SynopsisEpoxy resins are indispensable organic insulating material in electronic device fields such as semiconductors and printed circuit boards. Along with those technical innovations, the improvement demand for epoxy resins has been diversified and advanced. In this review, regarding seven kinds of typical high performance epoxy resins that can provide higher curability, higher heat resistance, lower moisture property, lower dielectric property, higher flame retardancy, higher flexibility and toughness and ultra high purity in our many creations, the studies on their molecular designs, synthetic technologies and evaluations are described. The important points in the design approach of high performance epoxy resins are considered as follows; to design molecular structures based on theories of relation between molecular structures and physical properties, to choose best skeletons for the functionalization, and to find out synthetic methods by which the skeletons are able to be introduced into the best positions.(Received March 16, 2010)

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© 2010 Japan Thermosetting Plastics Industry Association
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