Abstract
SynopsisHigher order structures of epoxy resins improved their thermal conductivities. Thermal conductivities were up to 5times higher than those of conventional epoxy resins by introduction of mesogen groups to form liquid crystalline structures which suppress phonon scattering. However, thermal conductivities of these epoxy resins are 1.0 W/m・K at a maximumand are still not enough to apply to electric devices which require high heat dissipation efficiency. We composed these resins and ceramic fillers to accomplish the epoxy resin composites which have both isotropic high thermal conductivities (10 W/m・K)and high electrical insulation ability. We conclude that the developed composites are effective for thermal management of electric and electronic devices.
