Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Review
High Heat Resistant Polymers for Automotive Electronics Field
Akio TAKAHASHI
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JOURNAL FREE ACCESS

2012 Volume 33 Issue 1 Pages 34-41

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Abstract
Power semiconductor devices are key devices for carbon dioxide reduction technology. Here, the author focuses on the power semiconductor device module of automotive electronics fi eld holding more than 50% of the power device market and introduce the optimum properties and gives an account of the examples for high heat resistant polymer materials applicable to the future power module.
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© 2012 Japan Thermosetting Plastics Industry Association
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