Abstract
Printed circuits on a fl exible fi lm are important components for fl exible electronics. Electroless metal deposition is a simple and cost-effective method to fabricate metallic patterns on a fl exible fi lm. We review the formation of a palladiumnanoparticle/silica-nanoparticle/acrylic-polymer hybrid negative pattern on a flexible film by photolithography and its conversion to a copper pattern by electroless plating. The negative pattern of the hybrid was formed by UV-irradiation of the resist film, which contained acrylate monomer, palladium salt, and a photo-radical initiator. The photochemically generated radicals induced the radical polymerization of the acrylate and also reduced the palladium ion to form palladium nanoparticles. A copper film was deposited on the surface of the hybrid pattern by electroless plating. On the surface of the hybrid, the palladium-nanoparticles work as a catalyst, and the nanometer-scale roughness caused with the silica nanoparticles, increases the adhesion between the polymer and copper.
