Development of the Phosphine System Curing Accelerator Achieving High Thermal Resistance and Higher Levels of Reliability

Abstract

Synopsis: It is known that phosphine system as a curing accelerator, generally, provides higher levels of reliability (moisture resistance) for the cured epoxy resin than that obtained with an imidazole accelerator. However, the epoxy resin cured with triphenylphosphine has lower T_g than those obtained with an imidazole accelerator such as 2-ethyl-4-methyl imidazole (2E4MZ). In this study, it is clarified that the epoxy resin cured with tri-p-tolylphosphine showed thermal resistance comparable to those with 2E4MZ, as well as higher reliability of moisture resistance.