Abstract
Synopsis: Today higher electrical performance in Information and Communication Technology is getting required and also, of course, in printed circuit board (hereinafter referred to as “PCB”). PCB using Poly phenylene ether (PPE) is very effective for high data transfer rate and for reduction of transmission loss as PPE has lower Dk and Df, whereas it had some issue of low process-ability and low solder heat resistance of PCB which attribute to high melt viscosity and low reactivity of PPE. We focused on low molecular weight PPE and were successful to apply PPE to PCB by changing thermoplastic resin PPE to unique thermosetting resin. Newly developed thermosetting resin system contains a large quantity of PPE as it is low melt viscosity. Furthermore, it was found out that hydroxyl terminated low molecular weight PPE has higher reactivity than high molecular weight PPE by this study. Moreover, copper clad laminate with this PPE and epoxy resin has higher glass transition temperature and lower dielectric property.
