High Thermal Resistant Molding Compound Using Hybrid Resin System of Epoxy Containing Triazine Ring and Bismaleimide

Abstract

Modified bismaleimide (BMI) with amine and epoxy resin containing allyl group and triazine ring (MADG, DAMG) indicated several advantages over using bisphenol-A type epoxy resin. For example, it had higher thermal resistance and lower thermal expansion. Moreover, this modified maleimide resin was prepared as a molding material for the purpose of development of next generation power devices for high heat resistant semiconductor encapsulation material. This molding material showed excellent thermal resistance and flame resistance without flame retardant. In this result, modified BMI with DAMG prove higher performance than conventional epoxy-phenol curing system for high thermal resistance molding materials.