Abstract
In recent years, due to the high density of the power semiconductor devices, heat dissipation and high heat resistance properties are required for the sealing epoxy resin. In this paper, we have developed with the aim of both high glass transition temperature and high thermal conductivity of the sealing epoxy resin. It was possible that a glass transition temperature of the epoxy resin (DGEBA) cured with cyanate (BADCY) had over than 200℃ by considering the ratio of the DGEBA/BADCY. Moreover, it was possible to improve 7W/(m・K) or more the thermal conductivity by filling Al2O3 and BN filler.
