Abstract
Epoxy resin compounds for encapsulation of semiconductor devices are used to protect the semiconductor devices from mechanical force, humid, heat and ultraviolet rays et al. As semiconductor packages are getting more sophisticated, smaller, and high density, they are required to offer improved performance and functionality. Recently, with the increasing global environmental awareness, the requirements for epoxy resin compounds for encapsulation of semiconductor devices have become environment responsive and energy saving. In this paper, the feature of epoxy resin compounds used for semiconductor molding compound, and the studies on flame retardancy and high heat resistance of epoxy resin compounds used for semiconductor molding compound are described.
