2016 Volume 37 Issue 6 Pages 261-265
The mesogenic epoxy monomer forming smectic phase has high melting point. We enabled the molding of the mesogenic epoxy composite by lowering a melting point by reacting the mesogenic epoxy monomer with resorcinol or hydroquinone partially. The mixture of mesogenic epoxy monomers and the prepolymers formed the higher order structure and maintained it even if the stoichiometric phenolic quantity for the epoxy increased to 0.5. The glass transition temperature of the cured material did not decrease even if the phenolic quantity was increased to 0.15. The thermal conductivity of the composite transfer molded with partial mesogenic epoxy/resorcinol prepolymer of epoxy/phenol stoichiometric ratio 10/1 was 8.9 W/(m・K) when the filler content was 76 vol%. In the case of the partial mesogenic epoxy/hydroquinone prepolymer of the same phenolic ratio, the thermal conductivity of the composite was 10.5 and 11.7 W / (m・K) when the filler content is 76 and 78 vol%, respectively. It was confirmed that the X-ray diffraction peaks of these molded materials were attributable to the smectic structure of the resin.
