Development of Thermosetting Resins for Electronic Materials

Abstract

In recent years, as electronic devices become higher in performance, higher performance is required for components. Various characteristics are required for the resin used for electronic materials. For example, high heat resistance for lead-free soldering process, flame retardance for environmental regulation, low dielectric properties for high speed transmission, low thermal expansion coefficient for reliability during mounting, low water absorption rate, and so on. Various resins have been developed to meet these requirements. This review introduces development of resin with high heat resistance, low dielectric property and flame retardance.