Abstract
Production of the printed circuit board in Japan has increased with the increase of the electronic parts for electronic instruments and ICs, and its total sales in 1988 reached 800 billion yen.
The shapes and necessary properties of printed circuit boards have varied with the parts mounting technology, especially with recent developments of the surface mounting technology.
Corresponding to high density mounting technology, the printed circuit board is increasingly required to provide fine circuits, small-diameter through-holes and multilayer structure. Furthermore, it is also required to have a good thermal emission property, electromegnetic interference shield effect, high speed signal transmission and coefficients of thermal expansion adjusted to that of mounted parts.
This paper reviews necessary properties and development of printed circuit boards as well as prepregs of mainly epoxy resin copperclad laminates, in accordance with development of the surface mounting technology.
