Abstract
Many of today's electronic and electric components are compacter, lighter and more efficient, then their predecessors due to higher integration, larger capacity and high mounting density of semiconductor devices. Chip sizes and pin counts of semiconductor devices have respectively become much larger and higher, also. But to increase mounting densities, package sizes have become smaller and thinner, and package configurations have been changed from pin insertion types to surface mounting types. This manufacturing changes require epoxy molding compounds to : (1) lower the thermal expansion coefficient, thus reducing thermal stress in the package; (2) lower the moisture absorption; and (3) increase the adhesion strength, thus improving the package crack resistance at reflow soldering. This paper reviews recent technological trends and future investigation topics for epoxy molding compounds.
