Abstract
The purpose of this work is to introduce a new diallyl terephthalate thermosetting resin from diallyl terephthalate (DAT), aromatic hydrocarbon (HC) and organic peroxide with an HC fragment at its initiat end point of each unit chain.
DAT resin gives molding compounds for injection, compression or transfer molding, and inherits not only the various characteristics such as dimensional stability, water and moisture resistance, stable and reliable electrical properties and so forth from the conventional diallyl phthalate resins (DAP and DAI), but gets also much better heat resistance than its precursor. DAT resin has higher temperature index of 180°C (Fig. 6) and better resistance to temporary but still elevated temperatures, for instance, to soldering bath of 360°C (Fig. 7), heating oven of 400°C (Fig. 8) or vapor phase soldering process of higher than 260°C (Table 4). Therefore, it would be most suitable for reflow-soldering of surface mounted electric circuit board.
Moisture resistance of this new material, excellent retention of performance properties desired after extended exposure to elevated temperature and high humidity environments, has been proved by aging test at 70°C and 100% relative humidity for as long as 12,000 hours conducting with phenolic, epoxy, polyethylene terephthalate (PET), polybutylene terephthalate (PET) and poly phenylene sulfide (PPS) (Fig. 13 & 14).
