Abstract
Recently, many kinds of epoxy resins containing unique skeleton have been developing and applying in IC molding compound industries. In this work, we developed a epoxy resin containing dicyclopentadiene (DCPD) skeleton. This epoxy resin could present high Tg, low moisture absorption, low dielectric constant and dielectric dissipation factor to its cured resin. So the effects of DCPD skeleton for the properties were studied.
In order to understand the effects of it, cured resins were preparetedat four different amount of DCPD skeleton content. Checking the relationship between DCPD skeleton content and various properties, many interesting results were obtained. As content of DCPD skeleton became higher, Tg of cured resins increased instead of almost same values of cross-linking density, dielectric constant and dielectric dissipation factor decreased. The increase of Tg was caused by larege stiffness and steric hinderance of DCPD skeleton. And electronic properties were known to be depended on molar volume and molar polarization according to Clausius-Mossotti equation. So we investigated they were caused by both of low content of OH group in cured resins with large molecular weight of DCPD skeleton and large bulkiness of it. And low moisture absorption could be explained by both of low content of OH group and low free volume with low cross-linking density.
