Abstract
The Properties of a thermosetting thin film adhesive with a range between 5 and 30 microns were investigated. The strength of adhesion and the heat resistance were found to strongly depend on the film thickness. Flow control of the adhesive film on heat press is necessary to maintain the thickness to an optimum value, while a good flow is important for keeping wettability. Therefore the viscoelastic property of the adhesive film before thermal cure is one of the key factors for reliability. The viscoelastic property after thermal cure, on the other hand, is a good index of heat resistance : it was found tto be a significant correlation between tan¥ and solder heat resistance.
