Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Low Thermal Expansion Nanocomposites Consisting of an Epoxy Resin and Clay with Organic Modifications
Tetsushi KONDATakeshi YOSHIMURAEiichiro SAITOTakao HAYASHIKoji MIWA
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JOURNAL FREE ACCESS

2003 Volume 24 Issue 3 Pages 186-192

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Abstract
Addition of modified clay of iminobispropylamine or acetylated bishexametylenetriamine into epoxy resin makes low constant of thermal expansion (CTE). The nanocomposites of nano-scale dispersed modified clay into the epoxy resin is able to make lower CTE. By evaluating the thermal property, we found that lower CTE is available in addition to less clay amount compared to using trivial inorganic filler. However, the more nano-dispersing, the system have lower Tg value. Then, we found that dispersing clays modified guanidine, which have three or four amino groups in the chemical structure and short main chains, make lower CTE and high Tg by adding smaller amount in epoxy resin treating by the same matter.
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© Japan Thermosetting Plastics Industry Association
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