Proceedings of National Heat Transfer Symposium
The 47th National Heat Transfer Symposium
Session ID : J124
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Host: The Heat Transfer Society of Japan

J12 OS1-2 Thermal Design and Cooling Technology Supporting Reliability of Electronic Equipment 2
Thermal Resistance Measurements of Printed Circuit Boards with Bump Interconnections
*Yuta Nakano, Sadakazu Takakuwa, Masaru Ishizuka, Tomoyuki Hatakeyama, shinji Nakagawa, Toshio Tomimura
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[in Japanese]
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© 2010 The Heat Transfer Society of Japan
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