2006 Volume 43 Issue 4 Pages 288-295
The concentration of hardener in the copper plating solution was estimated by measuring the physical properties of electrodeposited film. The COSMO G series(Daiwa Special Chemical Co., Ltd.)were used as additive agents, consisting of G-MU, G-1, and G-2. The G-MU consists of the brightener, polymer, and leveler. The G-1 was used as the hardener The G-2 was used as the refill for G-MU. The elongation with increasing the concentration of G-MU, but the hardness, glossiness, and number of scratches decreases with increasing this concentration. The hardness of electrodeposited film increases with increasing the concentration of G-1, whereas the elongation decreased exponentially with that of G-1.The concentration of G-1 was found to contribute to the physical properties from the fact that the hardness increases gradually and the elongation decreased exponentially with increasing the concentrations of both G-1 and G-MU. It was found that the concentration of G-1 containing the hardener in the plating solution could be estimated using the equation simulated from the multiple regression analysis. The correlation coefficient of the applied and estimated concentration of G-1 was 0.962 when the concentration of G-1 varied from 0.5 to 7ml⁄l.
