Abstract
Organic light emitting devices (OLEDs) and distributed-type inorganic electroluminescent (IOEL) panels are potential candidates for next-generation flat panel display and lighting solutions. Both technologies usually employ a bottom-emission structure built on a transparent glass or plastic substrate. On the other hand, top-emission organic light-emitting devices (TEOLEDs) have generated considerable interest in recent years owing to their wider aperture ratios in active matrix displays. And because the top-emission structure allows the use of a nontransparent substrate, the method also reduces cost. We fabricated top-emission IOEL devices on printed circuit board (PCB) substrates. Further, we developed a 0.2-mm-wide stripe IOEL device with red and green organic dyes for the design of PCBs.
